Construction of Machine Allocation Program for Semi-conductor Assembly Wire Bond Process

• Main Authors: Kuan-Tzu Chang, 張冠姿
• Other Authors: Chia-Yon Chen
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/21525391336740971608

碩士 === 國立成功大學 === 工學院工程管理專班 === 97 === The semiconductor industry has helped advanced the economic development growth in Taiwan. With the rising demand of semiconductors in the world market, Taiwan’s semiconductor products have been accepted globally and its industry has gained world attention. After twenty years of extensive and continuous research on the industry, Taiwan has achieved a small space in the global semiconductor market. With the present situation of shorter production time, new products entering the market and unstable orders, Taiwan semiconductor producers need to provide customers a higher product quality and quick delivery time to compete with other producers. Internally, companies should establish how to cope up with an efficient delivery schedule and enhance the maximum production of machines to reduce labor cost. This research is based on related data and production process of semiconductor assembly plants. The data focuses on, bottleneck wire bond station to the scheduling of the lead type plastic packaging, applying EXCEL and VBA program to establish wire bond machine connected to the intranet of the company to establish an automated calculation data from the production and provide management on time reports. Not only is this process time saving but it also provides accurate calculations and lowers internal cost, it also gives management more time to analyze different situations on the production. This proposed approach is applicable for semiconductor assembly plants. Wire bond machine scheduling can replace manual calculation and provide related reports and increase the production efficiency. This significant result shows that wire bond machine process scheduling has a strong effect in this research.