Transient Thermal Analysis and Reliability Evaluation for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
博士 === 國立成功大學 === 工程科學系碩博士班 === 97 === To evaluate conjointly the effects of ambient temperature fluctuation and operation bias on the reliability of board-level electronic packages, a coupled power and thermal cycling test has been proposed by JEDEC. In this study, thermal characteristics of a boar...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71773849382085031367 |