A Study for the Lead Plating WettabilityWith Pb and Pb Free Solder

A Study for the Lead Plating WettabilityWith Pb and Pb Free Solder

碩士 === 國立中興大學 === 資訊科學與工程學系所 === 97 === This research is to investigate the leadframe (L/F) including copper alloy and nickel-iron alloy (Alloy 42) in the integrated circuit packaging. We will compare their wetting ability by using wetting balance when the leadframs plating with pure tin, tin-lead,...

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Bibliographic Details
Main Authors:	Fu Lung Hsieh, 謝福龍
Other Authors:	黃德成
Format:	Others
Language:	zh-TW
Online Access:	http://ndltd.ncl.edu.tw/handle/09576314736944812609

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