A study on electric conductivity of a conductive paint with silver-coated copper flakes in epoxy and the paint on carbon fiber reinforced plastic surface for copper electroplating in copper sulfate bath

• Main Authors: Hsiang-Hsin Hung, 洪祥鑫
• Other Authors: Jun-Yen Uan
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/90651863168200758407

碩士 === 國立中興大學 === 材料科學與工程學系所 === 97 === The study used different weight percent conductive paint with silver-coated copper flakes in epoxy on carbon fiber reinforced plastic surface , employ the electric conductivity of paint for copper electroplating in copper sulfate bath to avoid the complex processes and surface defects of electro-less plating on carbon fiber reinforced plastic surface. The result of the experiment , the electric resistance of carbon fiber reinforced plastic tube surface is about 1.279x10-3Ω.㎝ 2 , it can’t plated copper with copper sulfate bath. There is not having continuous electric conduction net and complete electroplate layer of conductive paint while the silver-coated copper flakes less than 20 weight percent in epoxy. There is complete electroplate layer of the conductive paint while the silver-coated copper flakes more than 30 weight percent in epoxy. The electric resistance of conductive paint while the silver-coated copper flakes more than 40 weight percent in epoxy is 10-5Ω.㎝ 2. There is lower electric resistance(70%、1.265 x10-5Ω.㎝ 2),smooth electroplate surface and better combine while the conductive paint having higher weight percent of silver-coated copper flakes in epoxy. The conductive paint of 50 weight percent silver-coated copper flakes in epoxy had better cathode efficiency. The copper electrodeposited on electrics discharge point of conductive paint coated surface while the conductive paint had not enough of electric conduction net. The electroplate layer was fine island crystal and transverse growth by leveling effect. The electric discharge point is uniform distributed over conductive paint while the conductive paint had enough electric conduction net. The copper uniform electrodeposited fine particle or branch crystal on conductive paint surface. The electroplate layer was full covered with conductive paint surface and vertical growth of substructure. The XRD of copper electroplated on conductive paint surface was 100(43.22°)、34(50.32°)、18(74.07°).