Synthesis and Characterization of New Poly(ether sulfone)s and Multifunctional Epoxy Curing Agents.

• Main Authors: Tsai-Pei Wei, 魏采珮
• Other Authors: 林慶炫
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/62656910266200368736

碩士 === 國立中興大學 === 化學工程學系所 === 97 === [Part I] Biphenols (1-3) with bulky biphenylene phosphinate pendant were prepared by an efficient one-pot procedure. Base on these three biphenols (1-3), three poly(ether sulfone)s (P1-P3) were prepared. P1 and P2 were successfully prepared via a general procedure for poly(ether sulfone). However, P3, according to NMR analysis, was difficult to prepare under various conditions due to the cleavage of biphenylene phosphinate pendant (C-P bond) under alkaline condition. The thermal properties of P1 and P2 were studied and compared with a bisphenol A-based poly(ether sulfone), P0. P1 and P2 are flexible, creasable, and highly transparent with a cut-off wavelength around 327 and 328 nm, respectively. They display high glass transition temperatures (258 and 274℃ by DMA, respectively), lower coefficient of thermal expansion (48 ppm/oC by TMA) than those of P0 (208℃and 57 ppm/℃). [Part II] Three flame-retardant epoxy curing agents, m-DMP3, o-DMP3 and o-DMPA2, were prepared by an economic one-pot procedure. 1H NMR spectra indicate that only one compound in product when synthesizing curing agents (o-DMP3 and o-DMPA2). The resorcinol tends to react with electrophiles at ortho- and para- sites and leads to a mixture product (m-DMP3). These compounds served as curing agents for diglycidyl ether of bisphenol A (DGEBA) and cresol novolac epoxy (CNE). Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting epoxy thermosets were evaluated. The range of Tg in DGEBA curing system is 158-203℃. The resulting epoxy thermosets show high Tg and excellent flame retardancy.