Yield Study to Backend Wafer Level Assembly
碩士 === 明新科技大學 === 電子工程研究所 === 97 === The die size and the thickness of IC substrate always change due to the different market requirements while the semiconductor process and the product applications develop fast. In order to satisfy the market concerns, the improvement of wafer grinding and dic...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04832821610754694701 |