A Study of 1‚10-phenanthroline for Acid Copper Deposition

碩士 === 明新科技大學 === 化學工程研究所 === 97 === This investigation is performed by Electrochemical Impedance Spectroscopy (EIS) with various additive 1,10-phenanthroline concentration which could influence electroplate reaction mechanism. Determined by observing the semicircle generated from EIS can be get unc...

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Main Author: 陳毓祐
Other Authors: 梁世明
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/66434743803581044061
id ndltd-TW-097MHIT5062008
record_format oai_dc
spelling ndltd-TW-097MHIT50620082015-11-16T16:09:09Z http://ndltd.ncl.edu.tw/handle/66434743803581044061 A Study of 1‚10-phenanthroline for Acid Copper Deposition 以1,10-菲繞啉添加劑用於酸性鍍銅系統之研究 陳毓祐 碩士 明新科技大學 化學工程研究所 97 This investigation is performed by Electrochemical Impedance Spectroscopy (EIS) with various additive 1,10-phenanthroline concentration which could influence electroplate reaction mechanism. Determined by observing the semicircle generated from EIS can be get uncompensated resistance(Rs), charge transfer resistance(Rct) and electric double layer capacitance(Cdl). The equivalent circuit simulation was carried out by using the copper as working electrode. These results show the charge transfer resistance on additive-free was 28.06Ω, and when the additive concentration was increased 10ppm the charge transfer resistance was decreased 20.26Ω. But at additive concentration of 100ppm the diffuse appearance presented, and 45° vertical line on low frequency was observed . Additionally observation of surface morphology of thin film by using scanning electron microscope(SEM) or metallurgical microscope(MM), and measurement of crystal structure was carried out by using X-ray powder diffractmeter (XRPD). Finally measure the additive in four-point probe to observe the changes of thin film resistance. It is discovered at high-concentration level of 1,10-phenanthroline(50ppm) during the electroplate, the surface morphology of copper deposition was smoothed and the grain size was decreased 24.25nm. 梁世明 2009 學位論文 ; thesis 138 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 明新科技大學 === 化學工程研究所 === 97 === This investigation is performed by Electrochemical Impedance Spectroscopy (EIS) with various additive 1,10-phenanthroline concentration which could influence electroplate reaction mechanism. Determined by observing the semicircle generated from EIS can be get uncompensated resistance(Rs), charge transfer resistance(Rct) and electric double layer capacitance(Cdl). The equivalent circuit simulation was carried out by using the copper as working electrode. These results show the charge transfer resistance on additive-free was 28.06Ω, and when the additive concentration was increased 10ppm the charge transfer resistance was decreased 20.26Ω. But at additive concentration of 100ppm the diffuse appearance presented, and 45° vertical line on low frequency was observed . Additionally observation of surface morphology of thin film by using scanning electron microscope(SEM) or metallurgical microscope(MM), and measurement of crystal structure was carried out by using X-ray powder diffractmeter (XRPD). Finally measure the additive in four-point probe to observe the changes of thin film resistance. It is discovered at high-concentration level of 1,10-phenanthroline(50ppm) during the electroplate, the surface morphology of copper deposition was smoothed and the grain size was decreased 24.25nm.
author2 梁世明
author_facet 梁世明
陳毓祐
author 陳毓祐
spellingShingle 陳毓祐
A Study of 1‚10-phenanthroline for Acid Copper Deposition
author_sort 陳毓祐
title A Study of 1‚10-phenanthroline for Acid Copper Deposition
title_short A Study of 1‚10-phenanthroline for Acid Copper Deposition
title_full A Study of 1‚10-phenanthroline for Acid Copper Deposition
title_fullStr A Study of 1‚10-phenanthroline for Acid Copper Deposition
title_full_unstemmed A Study of 1‚10-phenanthroline for Acid Copper Deposition
title_sort study of 1‚10-phenanthroline for acid copper deposition
publishDate 2009
url http://ndltd.ncl.edu.tw/handle/66434743803581044061
work_keys_str_mv AT chényùyòu astudyof110phenanthrolineforacidcopperdeposition
AT chényùyòu yǐ110fēiràolíntiānjiājìyòngyúsuānxìngdùtóngxìtǒngzhīyánjiū
AT chényùyòu studyof110phenanthrolineforacidcopperdeposition
_version_ 1718131117336297472