The Study and Application of Micro-Electrodeposition Nickel-Cobalt alloy and Chemical Mechanical Polishing

碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 97 === In this paper, our main research is focus on parameters research about micro-electrodeposition Nickel-Cobalt alloys and chemical mechanical polishing to apply in micro-probe card manufacture process. In electrodeposition Nickel-Cobalt alloys, we set variou...

Full description

Bibliographic Details
Main Authors: Shih-Jyun Liao, 廖士鈞
Other Authors: Tsung-Chie Cheng
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/51646248995980830186
Description
Summary:碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 97 === In this paper, our main research is focus on parameters research about micro-electrodeposition Nickel-Cobalt alloys and chemical mechanical polishing to apply in micro-probe card manufacture process. In electrodeposition Nickel-Cobalt alloys, we set various parameters which obtains pH value, current density, bath temperature, and cobalt ion concentration to analysis the film hardness, electricity, surface morphologies, phase structure and alloy contents. In chemical mechanical polishing(CMP), we compared various pressures slurry temperatures, oxidation agent ratios, pH values and speeds to discuss the characteristics which obtain removal rate, uniformity and surface roughness. As the results, it was found that electrodeposition rate is raised accompany with current density and bath temperature raised. Higher cobalt content in deposited films were observed on higher cobalt ion concentration and lower current density, respectively, and also, cobalt content decreased accompany with bath temperature raised. However, the anomalous phenomenon is clearly found for the deposits plated from all cases, phase structures were belong to FCC, but diffraction intensity was found from the baths of pH5. The significant influence of the plating temperature on the hardness of Ni-Co deposits, which has been found in the case with the various current density and cobalt ion concentration. Internal stress and resistivity was also raised accompany with cobalt ion concentration raised, But insignificant influence of the resistivity was not found on the bath pH value changed. In another experiment, when we used polished cloth(545N), phenomena of over polish is improved. Removal rate and surface roughness are raised accompany with temperature. In the study of hydrogen peroxide, the removal rate of copper increased initially with an increase in H2O2 content at 3% and finally it decreased. After improved the process condition, we got the better film roughness which was deposited by sputter on operation condition of 70rpm, 63.7g/cm2 by use 545N polish cloth.