The Study of Mini-channel Thermal Module Design for High-stability and High Capability in Electronic Cooling

• Main Authors: Hsiang-li Wang, 王享立
• Other Authors: none
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/86035495169085629811

碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 97 === As the ever-lasting improvement of the electronic consumptive products such as personal computers and telecommunication equipment increases, so does the requirements with a higher power dissipation in order to keep the electronic equipment operated under temperature low enough to have a safe operation. The current research utilizes a oxygen-free copper plate on which two configurations of the flow channels were constructed: a plate with 18 gradually enlarged rectangular-shaped channels and a plate of 14 gradually enlarged U-shaped channels. The working fluid is RO water, at the operational pressure of 15kPa, and the heat transfer characteristics for two evaporators were also evaluated. The experiment results show that a maximum heat dissipation per unit area can reach 26.6 W/cm2 when the working fluid has a temperature of 60℃ and a flow rate between 20 to 80 ml/min. Unfortunately, a critical heat flux cannot be obtained due to the limitation of the power of the experiment. However, the power of the experiment is expected to be increased in the future. A total pressure drop of the mini-channels was calculated to be around 1 kPa which agrees very well with theory. The specific design of the gradually enlarge channels successfully prevents the bubbles from flowing back to the entrance of the channels as expected to have a better heat dissipation behavior. Also, the channels with a rectangular cross-section perform better in terms of heat dissipation.