Warpage Improvement for TSOP Product
碩士 === 義守大學 === 電子工程學系碩士班 === 97 === The curing effects on the warpage improvement for IC products are inrestigated in this paper. The experimental samples are TSOP-66. The optimal curing time prameters are determined from the experimental result.The optimal curing time prameters is 100~120sec from...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/66676336911707892988 |