Fabrication of the Micro-Bridge Electrostatic Modal Actuators

• Main Authors: HSU, EN-HAO, 許恩豪
• Other Authors: Wei-hsin Gau
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/93202113386967893716

碩士 === 華梵大學 === 機電工程學系博碩專班 === 97 === A electrostatic micro modal actuator adopted the orthogonality of the mode shape of the microstructure is fabricated. The construction of the micro actuator is designed as the micro bridge beam which is subjected to the fixed and fixed boundary. By using the design of the shape of the first mode electrode, the micro modal actuator can only be actuated at the first natural frequency. The stability of the actuator can be improved and the driving voltage can be reduced. In additional, the micro actuators with and without the full coverage electrode are fabricated as well.In the processes of fabrication, the P-type <1,0,0> double side polishing silicon wafer is used. The nitride Si3N4 is deposited by the method of low pressure chemical vapor deposition (LPCVD) on both sides of the wafer. The photoresist is spun, exposed and developed on the back side. For the purpose of opening the wet etch hole, the method of reactive ion etching (RIE) is used to etch nitride; 45% of KOH is used to etch the silicon until the thickness of silicon decreases to 50μm. In the processes of depositing the shape of the first modal electrode, the first mode shape of bridge beams is adopted by the method of photolithography. The aluminum is sputtered on the front side and the sacrifice is removed by the method of lift-off. The micro-bridge modal actuator is obtained by using RIE and inductively coupled plasma (ICP).