| Summary: | 碩士 === 逢甲大學 === 通訊工程所 === 97 === In recent years, due to the miniaturization of electronic products, the layout of electronic circuit has to be designed more and more tightly, and the Integrated Circuit manufacturing technology has been developing toward nm Process with higher operation frequency. From the viewpoint of the system, a more complex electromagnetic environment is so generated. As the components and wirings are positioned closer on the PCB layout, many extremely susceptible components may decrease the performance of the system or even cause errors when the interferences are very acute.
Therefore, in order to achieve the Electromagnetic Compatibility, EMI in the Integrated Circuit should be taken account first when designing the electronic circuit. In this paper, by using the simulation electromagnetic software to build the models of the radiations, the characteristics of the radiations in the Integrated Circuit were observed. According to the standard IEC 61967-2 (TEM cell method) and IEC 61967-3(Surface scan method), three same dies packed by LQFP technology with some minor modifications were used to make the testing board for measuring and analyzing the interferences of the electromagnetic radiations and for doing the surface scan on the near filed of the frequency of the acutest interference to find out the direction and the location of the radiation of the acutest interference.
|
|---|
