| Summary: | 碩士 === 逢甲大學 === 機械工程學所 === 97 === In MEMS, micro cantilever plates are often made of double layers.
During thermal treatment of micro fabrication process with temperature of hundreds degrees, residual stress would be induced after cooling to room temperature. It is for mismatching of thermal expansion coefficients between the metal layer and the structure layer as depositing metal on the structure. Therefore, the cantilever structure will be deformed. The structure layer would even be bent into undesired buckling conditions. It is called the warpage phenomena.
In this study, the finite element software, ANSYS, was employed to investigate the effects of various design parameters on the performance of cantilever plate with double layer. And the cantilever plate with double
layers was fabricated by surface micromachining process. Under different temperature of depositing process, after release as the sacrificial layer
removing, warpage can be observed. And residual stress can be calculated from deformation of the cantilever plate with double layers. From experimental results, it is also found a very small residual stresses exists after the annealing process.
The results of the simulation analysis and experimental
measurements show that length and width of micro plates have no significant effect on the residual stresses. However, temperature of fabrication process is the most important factor of affecting residual stress.
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