Oxidation and Plasma Modification Affecting the Wettability of UBM-Ni Layer with Sn-3.5Ag Lead Free Solder

• Main Authors: Jiun-Jiu Lai, 賴軍舉
• Other Authors: Yung-sen Lin
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/37009214579905412067

碩士 === 逢甲大學 === 材料與製造工程所 === 97 === Due to the environmental and health concerns of Pb, the European Union had prohibit the import of Pb-containing electronic products in 2006. Electronic industry must switch to lead-free solders, and several studies have been performed for lead-free electronic product and the use of the plasma, was more clean and environmental safety, technologies become more and more popular. This study focus on the relation of the wettability between UBM wetted layer, Nickel, and Sn-3.5wt%Ag lead-free solder. Ar-H2 plasma was used to as working gases to modify oxidized Nickel substrate surface. In this study, it was found that the wettability of oxidized Nickel substrate(200℃/2hr bake) can be enhance from 70% to 99%. And its total surface energy (TSE) decreased from 71mN/m to 51mN/m. By EDX inspection result, it was found that the composition of oxygens of oxidized Nickel is 34.17wt%(before oxidized is 5.63wt%). After Ar-H2 plasma surface treatment, the composition of oxygen becomes 1.41wt%. Ar-H2 plasma can remove nickel oxides and enhance the wettability with Sn-3.5wt%Ag lead-free solder