Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling

碩士 === 逢甲大學 === 材料科學所 === 97 === Abstract Ultrafine-grained (UFG) and nanocrystalline (NC) metals usually have higher strength than the coarse-grained counterpart but also exhibit low tensile ductility at room temperature. Recently, much attention has been drawn to improve the tensile ductility...

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Main Authors: Chia-Hao Yang, 楊家豪
Other Authors: Pei-Ling Sun
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/82054251681715473799
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spelling ndltd-TW-097FCU051590412015-11-13T04:09:37Z http://ndltd.ncl.edu.tw/handle/82054251681715473799 Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling 純銅經等徑轉角擠型與低溫軋延後之退火行為與機械性質研究 Chia-Hao Yang 楊家豪 碩士 逢甲大學 材料科學所 97 Abstract Ultrafine-grained (UFG) and nanocrystalline (NC) metals usually have higher strength than the coarse-grained counterpart but also exhibit low tensile ductility at room temperature. Recently, much attention has been drawn to improve the tensile ductility in the UFG/NC metals. In this study, pure copper (99.99%) was processed by equal channel angular extrusion (ECAE) and cryo-rolling to a rolling reduction of 95%. The as-deformed sample was then annealed at various temperatures ranging from 100oC to 320oC for 1 hour. The mechanical properties and microstructure of the as-deformed and isochronally annealed samples were investigated. to study the mechanical and annealing behavior of the NC copper. Low stacking fault energy (SFE) copper facilitates twin formation. Twins and/or stacking faults can hinder dislocation slip and increase dislocation accumulation and consequently increase work hardening rate and enhance tensile ductility. The yield stress (YS) is increased to 510MPa and the total tensile elongation is 6.1% in the as-deformed copper. The as-deformed microstructure appears to be lamellar structure and dislocation density within the grain interior is high. The annealed samples show that the average boundary spacing increases with increasing annealing temperature. When the NC copper was annealed at temperature below 200oC, the boundary spacing followd a stable growth rate and exhibits continuous recrystallization phenomenon, When the annealing temperature is above 200oC, the average boundary spacing increased dramatically and shows discontinuous recrystallization phenomenon. Samples annealed at 200oC for 30 minutes and 160oC for 5 hours appear to have better mechanical properties (higher strength and ductility combination) than other samples. However, the ductility of the NC copper is still fairly limited in the present work. Pei-Ling Sun 孫佩鈴 2009 學位論文 ; thesis 120 zh-TW
collection NDLTD
language zh-TW
format Others
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description 碩士 === 逢甲大學 === 材料科學所 === 97 === Abstract Ultrafine-grained (UFG) and nanocrystalline (NC) metals usually have higher strength than the coarse-grained counterpart but also exhibit low tensile ductility at room temperature. Recently, much attention has been drawn to improve the tensile ductility in the UFG/NC metals. In this study, pure copper (99.99%) was processed by equal channel angular extrusion (ECAE) and cryo-rolling to a rolling reduction of 95%. The as-deformed sample was then annealed at various temperatures ranging from 100oC to 320oC for 1 hour. The mechanical properties and microstructure of the as-deformed and isochronally annealed samples were investigated. to study the mechanical and annealing behavior of the NC copper. Low stacking fault energy (SFE) copper facilitates twin formation. Twins and/or stacking faults can hinder dislocation slip and increase dislocation accumulation and consequently increase work hardening rate and enhance tensile ductility. The yield stress (YS) is increased to 510MPa and the total tensile elongation is 6.1% in the as-deformed copper. The as-deformed microstructure appears to be lamellar structure and dislocation density within the grain interior is high. The annealed samples show that the average boundary spacing increases with increasing annealing temperature. When the NC copper was annealed at temperature below 200oC, the boundary spacing followd a stable growth rate and exhibits continuous recrystallization phenomenon, When the annealing temperature is above 200oC, the average boundary spacing increased dramatically and shows discontinuous recrystallization phenomenon. Samples annealed at 200oC for 30 minutes and 160oC for 5 hours appear to have better mechanical properties (higher strength and ductility combination) than other samples. However, the ductility of the NC copper is still fairly limited in the present work.
author2 Pei-Ling Sun
author_facet Pei-Ling Sun
Chia-Hao Yang
楊家豪
author Chia-Hao Yang
楊家豪
spellingShingle Chia-Hao Yang
楊家豪
Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling
author_sort Chia-Hao Yang
title Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling
title_short Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling
title_full Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling
title_fullStr Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling
title_full_unstemmed Annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling
title_sort annealing behavior and mechamical property in pure copper processed by equal channel angular extrusion and cryo-rolling
publishDate 2009
url http://ndltd.ncl.edu.tw/handle/82054251681715473799
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