Design and Implementation of the Grinding System for Hard and Brittle Materials

• Main Authors: Chen-Tung Lien, 連振東
• Other Authors: Chieh-Tsung Chi
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/68243690357245129939

碩士 === 建國科技大學 === 自動化工程系暨機電光系統研究所 === 97 === As many photo-electronic industries are increasingly developed, such as semiconductor, TFT-LCD(Thin Film Transistor Liquid Crystal Display), solar cell and so forth, regarding the cutting and grinding technologies are more and more concerned for the improvement of silicon and-glass qualities. In the process of grinding and cutting, there are six individual sub-processes are included: cutting, surface grinding, polish, beveling, side grinding and thin grinding. This paper aims at designing and implementing a side grinding system which mechanism is able to satisfy with the above-mentioned function requirements of equipment. It consists of transport, grinding, beveling, cooling and washing and CIM (Computer Integrated Manufacturing). Based on the requirements of flexible production and operating reliability, the control system was implemented by a PLC (Programmable Logic Controller, PLC). This PLC is then incorporated into a MMI (Man-machine Interface) to complete the relative necessary control works. On the one hand, the operator can realize the dynamic change of system parameters from the screen of MMI; on the other hand, operator also can command the system directly through the touch screen and as soon as possible. Keywords: Hard and brittle material, Grinding, Beveling, Man-machine interface, Semiconductor, Solar cell