Effects of Mechanical Properties and Geometry on Thermal Deformation of WBGA Packages
碩士 === 長庚大學 === 機械工程研究所 === 97 === The window ball grid array (WBGA) package has become one of the most popular alternatives for DRAM packaging due to its high I/O density, high heat dissipation, low profile and high electrical performance. The warpage performance of WBGA during solder reflow proces...
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| Format: | Others |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86132255909714410060 |