| Summary: | 碩士 === 國立中正大學 === 光機電整合工程所 === 97 === Our group have devoted to flexible electronics fabrication for a long time. There are three key issues for flexible electronics fabrication: patterning thin film on substrate without heating, the uniformity and thickness controllability of the thin film, and using Innovative μCP process” (Innovative Micro-Contact Printing process) in our laboratory has achieved that the polymer thickness is about 100~ 200 nm(the width is 80μm ,the pitch is 180μm [11].)
In this thesis, the high fidelity patterning of the innovative μCP process is evaluated and we propose two solutions, one is composite stamp process and the other is transfer inking process which are about using the interfacial adhesion work and the polymer cohesion work for the ink is printed to the substrate from the gap of patterned stamp, and edge-effect is produced by using a stamp which characteristic structure depth is about 1.7μm.. In current stage, the minimum line width of 10μm with 20μm in pitch is achieved. The thickness uniformity with 96%~99% （1-(σ/μ*)×100%） and maximum variation with 87%~98%（1-[max(|μ-μ*|)/μ*]×100%）are achieve.
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