Study on the Thermosonic Bonding of Gold Stud bump onto Flex Substrate with Nickel deposited Layer
碩士 === 國立中正大學 === 機械工程所 === 97 === Nowadays, the thermosonic wire bonding has been widely used to achieve electrical connections in microelectronic packaging. The objective of this study is focused on the effect of depositing an additional on the nickel layer on the bonding strength and bondability...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59382531205470352442 |