The Reliability Testing and Analysis of Lead-free Solder Joint under High-speed Shear Loading
博士 === 國立中正大學 === 機械工程所 === 97 === The solder joints play a crucial role in providing electrical and thermal connectivity throughout an electronic packaging. Thus, the reliability of the solder joints directly impacts on the performance of the electronic packaging. Therefore, evaluating the mechanic...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/70108491393411281339 |