A Suitability Study for the Shear and Bend Tests as substitutions for Thermal Cycling Reliability Test of Flip Chip Ball Grid Array Components
碩士 === 元智大學 === 機械工程學系 === 96 === The Accelerated Thermal Cycling(ATC) test is probably the most important and widely adopted reliability methods in various electronic packaging applications. However, it usually takes more than a thousand hours on this time-consuming test that also often causes a bo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87378753227021255570 |