A Study of Enhanced Boiling Evaporator Structure of Loop Thermosyphon

• Main Authors: Kung-Ting Chen, 陳冠廷
• Other Authors: Li-Chieh Hsu
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/kygqsw

碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 96 === At the time the external of electronic product steps approach to the aim of compactness gradually, the function and operation ability are also making a leap forward greatly. However, behind striving for perfection, the products contain crisis under keeping improving. Among them, the heat energy from these electronic elements grows with multiple; moreover, as the temperature gets higher, the lifespan of the electronic part cutbacks relatively. At present, the correlative cooling technology to high heat flux are loop heat pipe(LHP) 、 capillary porous loop (CPL) and two-phase loop thermosyphon (LTS) etc, and these skills are used mainly in cooling electronic products with high heat flux. This text research the enhance surface structure of LTS, change type of surface structure and the ratio of deep and wide to compare boiling situation. Besides, analyze the pressure of system and the difference of pipe diameters in evaporator to find out the establishment which improves LTS cooling efficiency.