| Summary: | 碩士 === 大同大學 === 機械工程學系(所) === 96 === Hot embossing technology has been developed for many years. This technique keeps updating and is used in many different way-from normal embossing to microstructure fabricating.
In this research, Micro Electro Mechanical System is used to fabricate the hot embossing mold. The mold can divide into the hot embedding mold and the hot embossing mold. The pressure sensor structure is fabricated by hot embedding and hot embossing technology.
Hot embedding technique is used to embed the metal structure into PMMA. When the temperature decrease, therefore, the adhesion of metal structure to SiO2 is difficult, the metal structure could be easy embedded into PMMA. In this research, the operator range of capacitive pressure sensor is 0-45psi. The sensitivity of the out put frequency is 1.1kHz/psi, and capacitance sensitivity is 0.0171 pF/psi.
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