| Summary: | 碩士 === 大同大學 === 材料工程學系(所) === 96 === Silver paste has been widely used for thin-film circuit fabrication process, especially for thin-film transistor and flat panel display. The usage of silver paste in traditional semiconductor fabrication process is including screen-printing, coating, and UV-curing. It was denounced with the consuming of time and cost. Ink-jet technology is a noncontact, quiet, and computerized high-speed technique. By using this technology, we can efficiently use the material to make lower cost and more environmentally-friendly.
The purpose of this research is to develop an ink-jet printable nano silver paste which can be printed on glass substrate and form a well-adhesion conducting wire. The research points are the synthesis of printable silver paste and the patterning ability of it on glass substrate. The higher concentration and lower particle size is on purpose to synthesis in order to get better electric conductivity. Viscosity and surface tension is adjusted for the piezoelectric printing head to make printable paste. Finally, the nano silver paste is printing on different substrates to examine the properties of adhesion and electric conductivity.
The result indicate that tannic acid is not only considered as a reducer but also effect dispersion, viscosity and surface tension of silver ink. Silver particles can be totally reduced from AgNO3 when 15.79g/L tannic acid is added. A well shape and adhesion of silver conducting wire which has 100μm width and 6.7 x 10-6Ω/cm2 sheet resistance can be printed on SnCl2 treated glass.
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