| Summary: | 碩士 === 淡江大學 === 機械與機電工程學系碩士班 === 96 === The main purpose of present study is to investigate the effect of various wicks and filling rate on vapor chamber heat spreader thermal performance. The T5 type vapor chamber has a dimension of 90.83mm×87.63mm×3.9mm, and the sintered columns made of copper powder were used as the wick. The R0 has a dimension of 58mm×58mm×6mm, and the capillary wick design was consisted of radial rectangular grooved. Thermal performance of the vapor chambers were evaluated experimentally in a fan-heat sink CPU test apparatus with heating area of 31mm 31mm and 13.97mm 13.97mm. The clamping pressure between the vapor chamber and the heat sink was maintained at 12.5kgf during the test.
After the evaluation, the T5 type vapor chamber with 35% D.I water filling rate showed the lowest evaporator-to-ambient resistance of 0.368℃/W, corresponding to a 14.62% decrease in thermal resistance at an input power of 122Watts, as compared to the system with copper plate. The results also showed a temperature difference lower than 1.69℃ on the entire condenser section, implied that the heat were spread uniformly to the heat sink. The R0 vapor chamber with 20% D.I water filling rate has the best performance as compared to the other filling rates. At the input power of 73Watts, the thermal resistance was 0.778℃/W, and it was still higher than copper plate about 0.446℃/W. We infer that larger channel width may cause poor capillarity.
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