| Summary: | 碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系碩士班 === 96 === The technique using thermoacoustic effect to move heat from one reservoir to another reservoir for cooling need have gradually emphasized a novel approach to thermal management in the electric devices. This is because of simple structure, efficiency, environmental safety, and high heat transfer rate. A miniature acoustic cooler without water-cooling heat exchanger is such a device case, which utilizes piezoelectric driver to create sound wave and have a mini-scale size.
The purpose of this study is to develop a miniature acoustic cooler for electronic cooling by implementation. Then a numerically and experimentally study is performed to explored the mechanism of related thermoacoustic operation and its characteristics of electronic cooling. In addition, the effects of various design parameters (e.g., input power of piezoelectric driver, gas-filling pressure, working fluid, and stack geometry) on the temperature difference exists on both end sides of the stack, and on cooling of electronic component are analyzed.
The research results show that the phenomenon of thermoacoustic effect exists on the porous stack, i.e., there is a temperature gradient along the stack. The maximum temperature difference existing on the whole stack increases with increasing input power of piezoelectric driver, and gas-filling pressure, and increases with decreasing Prandtl number of the gas. The changes in the position and length of porous stack have smaller on the temperature distribution along the stack. Furthermore, it was found that the better the thermoacoustic effect that the acoustic cooler has, the better the cooling capacity which reduces the maximum temperature appearing in the interior of electronic component and prolongs its life in use. The results of this study may be used as a reference for the goal to design a high-performance commercialized acoustic cooler or to perform an extensive application based on the present technique in the future.
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