| Summary: | 碩士 === 東海大學 === 工業工程與經營資訊學系 === 96 === The memory module industry is locates in the middle of the chain of memory industry, the processes of memory module is assemble several components with surface-mount technology on the print circuit board. This industry have long lead time to obtain the key material chip that produced from wafer fabrication factories with approximate 3 months and highly BOM alternative. Hence, the memory module industry must allocate the limit of supply to fulfill customer's demands effectively.
Besides, the multi-site production environment has more challenges than single-site, this research proposed a linear program model with the constraints such as material, capacity, transportation, material support between production sites, and the objective of the model is minimize the integrated manufacturing costs and employed the model with the software ILOG CPLEX. Via experimentation to compare the effectiveness between the mathematical model and the plan method that enterprise does. And also, get the suitable range of the model.
|
|---|
