Research on speed of anodic bonding by applying different metal electrodes
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 96 === The chip package technology of MEMS (micro-electro-mechanical systems, MEMS) is wildly used in commercial fabrication process, and anodic bonding plays an important role in mediumless joint technology of current package fabrication process. By means of an el...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/v8t759 |