Study of Cu film directly electroplating on InduimTin Oxide diffusion barrier
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 96 === In the research, the effect of electroplating Copper (Cu) film on Indium Tin Oxide (ITO) diffusion barrier was studied, improved by additional treatments and finally compared with electroless Cu and magnetron sputter Cu film. First, silicon (Si) substrate wa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/q7kbpq |
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