Study on Delamination of Lead Frame for Semiconductor Packaging
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 96 === This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process. The experiments are performed into three parts, first is epoxy curing...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7j93np |