Ball Grid Array Products Assembly Process Delamination Analysis and Improved Actions

• Main Authors: Chien-Chun Lee, 李健群
• Other Authors: Wen-How Lan
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/32562730095104196249

碩士 === 國立高雄大學 === 電機工程學系碩士班 === 96 === This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. The water contact angle, etching rate and surface morphology analysis were used to characterize the cleaning effect after the plasma clean process. After the process and reliability procedure, the delamination behaviors were characterized by the scanning acustic microscope. The parameters in the plasma cleaning procedure show great effects in the mechanical properties of the assembly body. Higher power and longer plasma cleaning time will enhance the delamination defect. Under the researches in the thesis, the delamination caused by the plasma cleaning process can be realized. With parameter optimization in plasma cleaning process, we can improve the process control and enhance the products quality.