| Summary: | 碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 96 === Driven by the demand for smaller and more-function on the electronic components nowadays, circuit designers urge to put more components on the IC package. Passive component producing technology becomes the important part. Passive component producing technology might be classified into the Surface Mount Devices (SMD), the Low Temperature Co-fired Ceramic (LTCC), and the thin film components. Thin Film Passive Device has the superior in integrating and size. This thesis has been discussed the Integrated Passive Devices including the capacitor and the inductor characteristics, as well as one of their variables such as the circle number, the width, the space, the radius and the capacitor area has been changed to investigate their scattering parameter, inductance, capacitance and Q-factor. The trend and the effect is analyzed by equivalent circuit of inductor. With these results, the 3rd-order band pass filter is designed up to 900MHz, and suitable for 900GSM communication applications. The last part of this thesis is the filter model on High Frequency Structure Simulator, and the results of simulation of the band pass filter have been compared with the equivalent circuits in Advance Design System.
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