| Summary: | 碩士 === 國立臺灣科技大學 === 電子工程系 === 96 === In this thesis, an innovative cooled coaxial package is developed for fiber-optic laser diode. It replaces the traditional Butterfly type rectangular package which is quite complicate and expensive, and leave room for cost-reduction. Even some new coaxial type cooled TOSA packages have been developed in the recent years, the high sensitivity of coupling efficiency (C.E.) loss due to thermal mechanical shift is still the issue. In this thesis, a new coaxial cooled TOSA package design is proposed to eliminate this issue.
The thesis consists 3 parts. Part-1 covers related information of key materials to be used in the design, and the product design idea. Three optical coupling systems are proposed. The optical simulation shows the calculated optical coupling efficiency are 22%, 36% and 46%, respectively (v.s. experimental values are 27.1%, 37.7% and 45.9%, respectively). Part-2 covers key technologies and processes of (1) Micro-module technology (2) TO-can packaging technology (3) Optical alignment technology and (4) Nd:YAG laser welding technology.
Part-3 reports the measurement results of the developed samples and provides the interpretation and future works. (1) Under the conditions of LD Iop=80mA, Tc=75°C, and Tset=40°C; Tset=35°C; Tset=30°C, respectively, the measured TEC power consumption is 0.55W, 0.65W and 0.75W, respectively, below the required specification of 1.0W. (2) When TEC is turned on. L-I measurement curves are almost overlapping. This proves the good working of TEC and design. (3) When TEC is turned on, the optical wavelength is within 0.16nm variation ranges from -40°C to 85°C (4) The thermal dissipation simulation exhibits only 1.12°C difference between LD thermal source point and the remote housing end. This shows no unacceptable heat sink. (5) The measurement of 2.5G CWDM 1470nm DFB cooled TOSA proves good DC and AC performances. (6) The measurement of 10G 1310nm DFB cooled TOSA proves good DC performance and up to 6G AC performance. The RF simulation of new header design shows good improvement at 10G operation.
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