| Summary: | 碩士 === 國立臺灣科技大學 === 高分子系 === 96 === This study selects biaxial stretch experiment simulating IMD（In-mold Decoration） process during high pressure forming; the biaxial stress that ink and film must bear, its superiority is,after experiment; the sample is flat, which is easy to observe, besides; it can precisely control strain that ink and substrate must bear. Take draw ratio as parameter,to observe stress filed regarding BOPET film respectively on symmetrical and non-symmetrical surface decoration graphic after stretch, as well as reviewing physical properties、stress distribution、destruction behavior of BOPC film、optical and interface property of ink after stretch. The photoelastic experiment is selected and performed for observation of stress fields, from afore-mentioned a series of experiments to obtain optimal processing conditional parameter and finished product design principle.)
To proceed the analysis on ink used about sedimentation rate and particle size distribution. The experiment uses Dispersion Analyser LUMiSizer of L.U.M.(Labor-Umweltdiagnistik & Medizintechnik), with optical and centrifugal analytical method in making use of relationship between particle mobility rate and light transmission to record particle behavior accompanying time change.
|
|---|
