Study on Wettability and Mechanical Properties between Lead-Free Solders and Different Finished Substrates
碩士 === 國立臺灣科技大學 === 材料科技研究所 === 96 === The wettability and mechanical properties between Sn-0.7wt%Cu, Sn-3.0wt%Ag-0.5wt%Cu, Sn-58wt%Bi and Sn-37wt.%Pb solders under Sn- Pb/Ni-P, Sn/Ni-P and Au/Ni-P plating finished on C5191 (Cu-4.0wt%Sn -0.2wt%P), C7521 (Cu-18.0wt%Ni) and C2680 (Cu-18.0wt%Zn) substr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54345770489854203005 |