| Summary: | 碩士 === 國立臺灣科技大學 === 材料科技研究所 === 96 === The wettability and mechanical properties between Sn-0.7wt%Cu, Sn-3.0wt%Ag-0.5wt%Cu, Sn-58wt%Bi and Sn-37wt.%Pb solders under Sn- Pb/Ni-P, Sn/Ni-P and Au/Ni-P plating finished on C5191 (Cu-4.0wt%Sn -0.2wt%P), C7521 (Cu-18.0wt%Ni) and C2680 (Cu-18.0wt%Zn) substrates were investigated in this work, which includes the wetting balance and shear strength measurement.
A vertical substrate plate is immersed into a molten solder bath. The force performed on the plate is measured by utilizing a wetting balance. Experimental results demonstrate the basic wettability of diverse lead-free solders on difference substrate’s plating finished by a wetting balance, such as wetting time, wetting force, contact angle and surface tension.
Moreover, the solder’s wettability compared with the shear strength of the joints under difference substrate’s plating finished. The results of this studying, it clarifies the shear strength of joints varies by plating finished, irrespective of the under substrate. And Pb additions as small as 10% composition in Sn plating finished, it will be improved wettability due to soldering and strength of the joints.
|
|---|
