Growth Mechanism of Tin Whiskers by Changing Current Density in the Matte Tin System
碩士 === 國立臺灣科技大學 === 材料科技研究所 === 96 === Tin whisker growth mechanism and wettability with different electroplating conditions were studied in this work. It was expected that the optimal processing parameters to prevent the whisker growth could be found. Matte Sn was electroplated on the copper at var...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35200882314893171792 |