Study of interfacial reactions and mechanism properties between SAC and SACNG lead free solders with Au/Ni/Cu in BGA package
碩士 === 國立臺灣科技大學 === 化學工程系 === 96 === Abstract Element of Cu、Ni and Ag as substrate have been widely used for electronic packaging industry. In bonding process, the element diffusion between solders and substrate will grows brittle intermetallic compound (IMCs) at the interface. Because it has diffe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06574119292091409988 |