Thermal Fatigue Life and Quantitative Reliability Analysis of Wafer-Level Chip Scale Packages
碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === In study the reliability of electronic packages from mechanics point of view, the results of stress and strain obtained from finite element analysis are deterministic values. The fatigue life of the package predicted based on a modified Coffin-Manson equation or...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66362404439007051484 |