The Heat Dissipation System of OAPCP-micropump for a Laptop

• Main Authors: Jhong-jhih Gao, 高仲志
• Other Authors: Hsiao-Kan Ma馬小康
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/55031532969591703363

碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === In this study a new one-side actuating piezoelectric micropump combined with a cold plate (OAPCP-micropump) in a liquid cooling system to solve heat dissipation problems and to improve electronic device reliability for a laptop. The OAPCP-micropump, which is composed of a PDMS diaphragm, a 45(mm)*28(mm)*4(mm) pump chamber with added fins, a rectangular piezoelectric device, and two check valves, can allow a thinner design and drive liquid in one direction. The results show that the shape of the fins has a strong effect on the pressure drops and flow profiles. The fluid in the pump chamber may impinge on the fins and increase the heat dissipation rate due to the oscillation by the actuator. When the fins are shorter than 1.25(mm), they have a negligible effect on the performance of the OAPCP-micropump. In addition, increasing the number of fins from 6 to 12 can enhance the heat dissipation rate but has no influence on the flow rate. The measured maximum flow rate of the OAPCP-micropump is 4.1(ml/s), and its maximum pump head reaches 9807(Pa). The OAPCP-micropump sets on the electrical device dissipating the heat by the water flow. In open system fixed the power input and the flow rate respectively, measures the thermal resistance and the flow rate of the OAPCP-micropump to improve the designation. The thermal resistances of OAPCP-micropump are 0.15(℃/W)、0.31(℃/W) in open system and circulation system , respectively, the system thermal resistance is 0.97(℃/W) while input frequency 140(Hz). In general, the new cooling system with an OAPCP-micropump design shows a stable performance on total thermal resistance due to the high flow rate.