Micromachined RFIC by CMOS-Compatible ICP Deep Trench Technology
博士 === 國立臺灣大學 === 電子工程學研究所 === 96 === A novel micromachining technique, Deep Trench Technology, is invented to completely remove the lossy silicon underneath the inductors of RFICs by utilizing Inductively-Coupled Plasma etching (ICP). By means of the proposed technique, it is observed that the qual...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87744501138415175029 |