| Summary: | 碩士 === 國立臺南大學 === 系統工程研究所產碩專班 === 96 === LED has important characteristics such as environmental protection and energy-conserving, it has already considered as revolutionary light source products in recent years. The whole world pays lots of attention to its development. With the progress of LED material and technology, the luminance of LED products improves constantly, its application is wider and wider, and the power needed is also improved. Its working current increases from about 20 mA of the early low power LED to about 1A of the currently developed high power LED. The input power of single LED has increased up to more than 1 W. This causes more heat to be generated. If the heat is not being taken away properly and effectively, the luminescence efficiency and life-span of the LED will be greatly influenced because that the interface temperature of the LED chip and the substrate will be too high. This paper combines thermoelectric cooling module, which can be used as a heat sink, with the cooling fin and fan to see the heat dissipation rate of different combination of thermoelectric cooling module, fin and fan. The experimental results show that the thermoelectric cooling module can lower at least 10 degrees of the LED substrate temperature even without the aids of cooling fan and fin. The results will be even better if fan and fin are installed along with the thermoelectric cooling module. Besides, due to the operating restriction and requirement of the life test of LED industry, cost and volume consideration of the test is also crucial in the schedule of our test matrix. These considerations make this thesis more valuable and practical.
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