The value chain analysis of Foundry test divisions in the test & packaging market

• Main Author: 林宗仁
• Other Authors: C. Y .Wu
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/48257092546199682811

碩士 === 國立清華大學 === 高階經營管理碩士在職專班 === 96 === Abstract Semiconductor is one of the most important industries in Taiwan during the past 30 years. The output value of semiconductor in 2004 has been over 1.1 trillion NT dollars which is the first industry hitting the target of 6-year government economic strategy named「Two Trillion & Twin Star」addressed in 2000. The Industrial Development Bureau Ministry of Economic Affairs forecasts that the output value of Taiwan semiconductor industry in 2008 will reach 1.75 trillion NT dollars and more than 2 trillion NT dollars in 2009. For the Taiwan wafer foundry industry, the worldwide market share of wafer fabrication has launched to 69.2%; IC packaging and testing has reached 44.8% and 60% worldwide market share respectively in 2005. Although Taiwan has been playing the most important role in the wafer foundry industry of the world, there still existing a lot of challenge from their international competitors such as Chartered, SMIC (Semiconductor Manufacturing International Corporation) and other new comers. In order to keep the leading edge in this foundry business, all the foundry Fabrication companies have to keep developing not only their advanced process technology with best quality system, but have to try to extend their service scope from wafer manufacturing to the very early stage of IC design and related IP verification. On the other hand, Foundry should elaborate to extend their wafer manufacturing service to the backend test and packaging whole solution to pursue more differential and added value. The “ Test and Packaging” divisions of foundry Fabs have been playing the most critical value chain for the process linkage between them. The major purpose of this thesis is trying to analyze the core value of test and packaging divisions including provide the fast yield feedback information to their front-end wafer fabrication manufacturing in order to enhance their process yields. On the other hand, this division also provides their foundry customers with backend total solution in order to make their customer win in the market. In order to approach the above two core values of test and packaging division of foundry fabs, this division needs to keep the advanced technology roadmap on both testing and packaging engineering. Meanwhile this division also has to integrate all the backend resources with cost effective and differential ways to provide the best services to either fabless or IDM customers and create the exclusive added value and competency while compete with her competitors.