| Summary: | 碩士 === 國立屏東科技大學 === 材料工程所 === 96 === In this work, the Ni-P thin films were deposited on Fe/Au/Si substrate by electroless plating. The pH values of plating solution are 4.2, 4.6, 5.0 and 5.4. The deposited samples were annealed in rapid thermal annealing (RTA) furnace at 300 and 350℃ for various periods. The mechanical properties of electroless Ni-P film on Fe/Au/Si substrate deposits were studied by using nanoindentation measurements. The results show that hardness (H) and reduced elastic modulus (Er) of as-deposited samples drastic decrease as plating time increase in the initial stage and become smooth at latter stage for as-deposited samples. The hardness is about 6.5GPa for pH 5.0 for 192sec and for pH 5.4 for 160 se. For 300℃ annealed samples, the hardness (H) and reduced elastic modulus (Er) of samples increase as plating time increase, the H maximum is 9.92Gpa for pH5.4 annealing 30 min, the Er maximum is 156.01GPa for pH5.0 annealing 30min. For 350℃ annealed samples, the hardness (H) and reduced elastic modulus (Er) of samples decrease as plating time increase. The H maximum value is 11.32GPa for pH4.6 annealing 10 min and the Er maximum value is 168GPa for pH5.0 annealing 5min.
|
|---|
