| Summary: | 碩士 === 國立高雄第一科技大學 === 環境與安全衛生工程所 === 96 === The edge bead removal (EBR) chemical is widely utilized in the TFT-LCD and semiconductor industry for wafer cleaning. As the industry evolves, there is also a growing need for much tougher quality control measures. If not controlled properly, unwanted particles in the EBR chemical could hider wafer cleaning quality greatly.
The process in this study is at the filtering and packing stage of an EBR production plant. It was found that the original, lower-end, filtering and quality assurance process does not adept well to the new request for much higher quality need. It was the extent of this study to investigate all the possible combinations of process parameters in order to achieve better results.
As a result of thorough investigation, three parameters, chemical type, pressure, filter materials govern the final product quality. The parameter combinations were chosen according to the orthogonal arrays, which greatly reduces time for experiments, since only 9 experiments out of 27 need to be done. The criterion for experiments includes the filter life, productivity, and replacing and assembly cost. Results based on the best parameter combinations have been proven to be quite satisfactory.
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