A Routing Direction and Remapping Based Algorithm For Flip-Chip Routing

• Main Author: 邱嘉宏
• Other Authors: 魏凱城
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/33607490278501169501

碩士 === 國立彰化師範大學 === 資訊工程學系 === 96 === The flip-chip package provides the best solution that has the highest chip density in all package technologies to support the pad-limited VLSI designs. In this literature, we propose a routing algorithm for the flip-chip package. Our routing algorithm can search a suitable routing path from bump pads to driver pads and route each of them. In our routing algorithm,there are four stages including Classifying, Remapping, Global Routing and Detail Routing, respectively. Classifying categorizes the bump pads to determine the direction of the Global Routing. Remapping renames the new IDs for each bump pad and its corresponding driver pad according to the position of its corresponding driver pad. Global routing selects a suitable routing path to prevent all collisions with other wires. According to the global routing results,Detail routing can construct the physical design within the design constrains.Experimental results base on four benchmarks which are provided by CAD Contest, and our total wire-length is shorter than the best results in the CAD Contest [1]. The advantage is that our proposed algorithm uses less time to solve the problem of the flip-chip routing and the memory usage of the program is very low. Finally, the layout is shown in the text file of the grid, therefore we can easily observe the placement of any bump pad, driver pad or wire,and can manufacture the real design according to the text file.