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碩士 === 國立中央大學 === 光機電工程研究所 === 96 === Localized heating by CO2 laser followed by water quenching was applied to control fracture growth for cutting ceramic substrate. The process was successfully demonstrated on breaking LED LTCC ceramic substrate with a laser cutting platform...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60389466095460542336 |