| Summary: | 碩士 === 國立中央大學 === 機械工程研究所 === 96 === This thesis is the first one to present “a 2-D analytical solution of film planarizatsion for spin coating”. This analytical solution is used for predicting the degree of planarization (abbreviated as DOP), and describing the film distribution. Among semiconductor manufacturing process, utilizing spin coating can obtain the micro-thick film, and help other process to produce the elements. The thin film on the wafer which has period structures is coated by spin coating. We can describe the phenomenon by four order partial differential equation. And it can be used to solve out the symbolic solution by linearizing the partial differential equation at four subregions which is the part of the period structure. We describe the DOP by using the governing dimensionless parameter at different conditions. The represents the ratio of centrifugal force to surface tension force during spin coating. When approach to infinite, surface tension is zero, and the film is always conformal. When approach to zero, surface tension is infinite, and the film is planar The DOP of narrow rectangular or square feature decreases with decrease of the space between two features on X direction. A comparison shows that DOP will increase with decrease of the space between two features on Y direction. And for height of the feature, DOP changes slightly with increase of the .Finally, for the most conditions, no matter how the features and parameters change, at high , DOP will steady at -25% and not change with any more.
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