Using chemorheology to discuss the apply of the epoxy with DOPO and Al(OH)3 on prepreg.

• Main Authors: CHENG-CHANG HSIEH, 謝政璋
• Other Authors: teng-ko chen
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/68896840679692293125

碩士 === 國立中央大學 === 材料科學與工程研究所 === 96 === Epoxy has been used in Laminar, IC carrier and paints, the halogens resin material was used to content the higher request of the thermal resistance, although it represented well to the flame-retardant effect, but it will bring the caustic and poisonous gas and a lot of smoke and dioxin when it was burned, there were many countries taking it into control. The flame-retardant efficient of the organic phosphorus fire retardant is good, and produces fewer caustic gas, but the performance of the flame-retardant effect is bad, the plasticization is resulted and Tg is reduced；In the industry of PCB, the nanometer filler was used to reduce the effect of the thermal expansion, increase the efficient of thermal conduction and the thermal resistance, In this article, the experiment is designed by using the Taguchi method, and the prepreg was made by using the epoxy with DOPO, the filler of Al(OH)3,Dicy and 2-MI, analyzed the Chemorheology by using TGA, DSC,plate to plate rheometer, to estimate that is Al(OH)3 suited the epoxy with DOPO, and try to make suggestions to the parameter of lamination.