Model Analysis and Run to Run Optimal Control of Plasma Enhance Chemical Vapor Deposition Process

碩士 === 國立交通大學 === 機械工程系所 === 96 === In this thesis, we discuss with the property of PECVD equipment deposit TEOS Oxide film in different process conditions. First, we choose two input parameters (chamber pressure and the gas flow rate of O2) and two output variables(deposition thickness and ununifor...

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Bibliographic Details
Main Authors: Wei-Ting Yu, 余偉庭
Other Authors: Stone Cheng
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/56826821845867675314